www.centralsemi.com r0 (5-may 2011) package details tlm2d3d6 case mechanical drawing mounting pad geometry (dimensions in mm) part marking: single character alpha/numeric code lead code: 1) cathode 2) anode
www.centralsemi.com r0 (5-may 2011) package details tlm2d3d6 case tape dimensions and orientation (dimensions in mm) tape width: 8mm reel labeling information each reel is labeled with the following information: central part number, customer part number, purchase order number, quantity, lot number, date code, ship date and marking code. packaging base 7 reel = 8,000 pcs. reel packing information ordering information ? for devices taped and reeled on 7 reels, add tr suffix to part number. ? all smds are available in small quantities for prototype and manual placement applications. devices are taped in accordance with electronic industries association standard eia-481-1-a reel size reels per box (maximum) parts per box (maximum) box dimensions shipping weight (max.) inch cm lb kg 7 9 18 40 108 72,000 144,000 320,000 864,000 9x9x5 9x9x9 21x9x9 27x9x17 23x23x13 23x23x23 53x23x23 69x23x43 3 6 13 34 2 3 6 16 direction of unreeling
material composition specification tlm2d3d6 case device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 g fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% www.centralsemi.com r1 (3-june 2011) component material material substance cas no. substance (%wt) (g) (%wt) (g) (ppm) active device doped si 6.92% 10 si 7440-21-3 6.92% 10 69,247 bond wire gold 0.28% 0.4 au 7440-57-5 0.28% 0.4 2,770 leadframe cu alloy 27.44% 39.63 cu 7440-50-8 27.23% 39.33 272,350 sn 7440-31-5 0.07% 0.1 692 zn 7440-66-6 0.07% 0.1 692 cr 7440-47-3 0.07% 0.1 692 die attach silver epoxy 2.77% 4 ag 7440-22-4 1.94% 2.8 19,389 epoxy resin proprietary 0.83% 1.2 8,310 encapsulation* emc green 62.32% 90 silica (fused) 60676-86-0 52.97% 76.5 529,742 epoxy resin 29690-82-2 4.67% 6.75 46,742 phenol resin 9003-35-4 1.56% 2.25 15,581 carbon black 1333-86-4 0.19% 0.27 1,870 metal hydroxide 1309-42-8 2.93% 4.23 29,292 plating ni/pd/au 0.26% 0.38 ni 7440-02-0 0.25% 0.36 2,493 pd 7440-05-3 0.01% 0.01 69 au 7440-57-5 0.01% 0.01 69 *emc green molding compound is halogen-free. disclaimer the information provided in this material composition data sheet is, to the best of our knowledge, correct. however, there is n o guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
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